HDI 회로 기판이란?

HDI (High Density Interconnect) PCB 회로 기판이란 무엇입니까?

High-density interconnect (HDI) PCB is a kind of (technology) for the production of printed circuit boards. It uses a micro-blind hole and buried hole technology for a circuit board with a high density of line distribution. Due to the continuous development of technology for the electrical requirements of high-speed signals, circuit boards must provide impedance control with AC characteristics, high-frequency transmission capabilities, and reduction of unnecessary radiation (EMI). With the structure of Stripline and Microstrip, multi-layer design becomes a necessary design. In order to reduce the quality problem of signal transmission, a low dielectric constant and low attenuation insulating material will be used. In order to match the miniaturization and arraying of the electronic component structure, the circuit board will also continue to increase the density to meet the needs.

It adopts a modular and parallel design. One module has a capacity of 1000VA (1U in height) and is naturally cooled. It can be directly placed in a 19 “rack. It can be connected in parallel with 6 modules. The product uses full digital signal processing (DSP) technology and multiple The patented technology has the full range of adaptable load capacity and strong short-term overload capacity, which can ignore the load power factor and crest factor.

HDI (High-Density Interconnect) 회로 기판에는 일반적으로 레이저 블라인드 홀과 기계식 블라인드 홀이 포함됩니다. 일반 관통 매립 홀, 막힌 홀, 적층 홀, 엇갈린 홀, 교차 블라인드 매립, 관통 홀, 막힌 홀 충전 홀 도금, 미세 라인 작은 갭, 디스크 내부 사이의 전도를 달성하는 마이크로 홀과 같은 기술 그리고 외부 층, 일반적으로 묻힌 직경은 6mil보다 크지 않습니다.

HDI 회로 기판은 1 차, 2 차, 3 차, 4 차 및 모든 레이어 상호 연결로 나뉩니다.

1- 레벨 HDI 구조 : 1 + N + 1 (프레스 2 회, 레이저 1 회)

2 차 HDI 구조 : 2 + N + 2 (프레싱 3 회, 레이저 2 회)

3 차 HDI 구조 : 3 + N + 3 (프레싱 4 회, 레이저 3 회)

4 차 HDI 구조 : 4 + N + 4 (5 회 프레스, 4 회 레이저)

From the above structure, it can be concluded that the laser is a first-order plate once, twice as a second-order plate, and so on. Of course, any layer interconnection can be lasered from the core board. Before the lamination, the laser is required to be any layer interconnection HDI.

At present, the HDI circuit boards that Shenze multilayer circuits can be batched are mainly within 3rd order, and the interconnection of 4th order and any layer is limited to the production of small batch samples. R & D is currently being strengthened. Layer interconnection will be mass-produced.

While electronic design is constantly improving the overall performance, it is also striving to reduce its size. From small mobile phones to smart portable small portable products, “small” is always the pursuit. High-density integration (HDI) technology enables smaller end product designs while meeting higher standards for electronic performance and efficiency. HDI is currently widely used in mobile phones, digital (camera) cameras, MP3, MP4, notebook computers, automotive electronics and other digital products, among which mobile phones are widely used. HDI boards are generally manufactured using the build-up method. The more times they are laminated, the higher the technical grade of the board. Ordinary HDI boards are basically laminated one time, and high-level HDI boards are laminated twice or more. At the same time, advanced PCB technologies such as hole stacking, plated hole filling, and laser direct drilling are used. High-end HDI boards are mainly used in 3G mobile phones, digital cameras, and IC carrier boards.

다음 그림은 당사에서 일괄 생산 한 2 차 및 3 차 HDI 회로 기판을 보여줍니다.