ما هي لوحة دوائر HDI

ما هي لوحة دوائر PCB (التوصيل البيني عالي الكثافة)؟

High-density interconnect (HDI) PCB is a kind of (technology) for the production of printed circuit boards. It uses a micro-blind hole and buried hole technology for a circuit board with a high density of line distribution. Due to the continuous development of technology for the electrical requirements of high-speed signals, circuit boards must provide impedance control with AC characteristics, high-frequency transmission capabilities, and reduction of unnecessary radiation (EMI). With the structure of Stripline and Microstrip, multi-layer design becomes a necessary design. In order to reduce the quality problem of signal transmission, a low dielectric constant and low attenuation insulating material will be used. In order to match the miniaturization and arraying of the electronic component structure, the circuit board will also continue to increase the density to meet the needs.

It adopts a modular and parallel design. One module has a capacity of 1000VA (1U in height) and is naturally cooled. It can be directly placed in a 19 “rack. It can be connected in parallel with 6 modules. The product uses full digital signal processing (DSP) technology and multiple The patented technology has the full range of adaptable load capacity and strong short-term overload capacity, which can ignore the load power factor and crest factor.

HDI (High-Density Interconnect) circuit boards usually include laser blind holes and mechanical blind holes; general through-buried holes, blind holes, stacked holes, staggered holes, cross-blind buried, through-holes, blind hole filling hole plating, fine line small gap, Technologies such as micro-holes in the disc to achieve conduction between the inner and outer layers, usually the buried diameter is not greater than 6mil.

HDI circuit board is divided into: 1st order, 2nd order, 3rd order, 4th order and any layer interconnection

1-level HDI structure: 1 + N + 1 (2 times pressing, 1 time laser)

Second-order HDI structure: 2 + N + 2 (3 times pressing, 2 times laser)

3rd order HDI structure: 3 + N + 3 (4 times pressing, 3 times laser)

4th order HDI structure: 4 + N + 4 (5 times pressing, 4 times laser)

From the above structure, it can be concluded that the laser is a first-order plate once, twice as a second-order plate, and so on. Of course, any layer interconnection can be lasered from the core board. Before the lamination, the laser is required to be any layer interconnection HDI.

At present, the HDI circuit boards that Shenze multilayer circuits can be batched are mainly within 3rd order, and the interconnection of 4th order and any layer is limited to the production of small batch samples. R & D is currently being strengthened. Layer interconnection will be mass-produced.

While electronic design is constantly improving the overall performance, it is also striving to reduce its size. From small mobile phones to smart portable small portable products, “small” is always the pursuit. High-density integration (HDI) technology enables smaller end product designs while meeting higher standards for electronic performance and efficiency. HDI is currently widely used in mobile phones, digital (camera) cameras, MP3, MP4, notebook computers, automotive electronics and other digital products, among which mobile phones are widely used. HDI boards are generally manufactured using the build-up method. The more times they are laminated, the higher the technical grade of the board. Ordinary HDI boards are basically laminated one time, and high-level HDI boards are laminated twice or more. At the same time, advanced PCB technologies such as hole stacking, plated hole filling, and laser direct drilling are used. High-end HDI boards are mainly used in 3G mobile phones, digital cameras, and IC carrier boards.

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