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Печатная плата HDI

High-density interconnect  HDI PCB is a kind of (technology) for the production of printed circuit boards. It uses a micro-blind hole and buried hole technology for a circuit board with a high density of line distribution. Due to the continuous development of technology for the electrical requirements of high-speed signals, circuit boards must provide impedance control with AC characteristics, high-frequency transmission capabilities, and reduction of unnecessary radiation (EMI). With the structure of Stripline and Microstrip, multi-layer design becomes a necessary design. In order to reduce the quality problem of signal transmission, a low dielectric constant and low attenuation insulating material will be used. In order to match the miniaturization and arraying of the electronic component structure, the circuit board will also continue to increase the density to meet the needs.
Печатные платы HDI PCB (High-Density Interconnect) обычно имеют глухие отверстия для лазера и механические глухие отверстия; общие сквозные заглубленные отверстия, глухие отверстия, уложенные друг на друга отверстия, ступенчатые отверстия, поперечно-глухие заглубленные, сквозные отверстия, покрытие отверстий для заполнения глухих отверстий, мелкий зазор с тонкой линией, такие технологии, как микроотверстия в диске для достижения проводимости между внутренними частями и внешние слои, как правило, заглубленный диаметр не превышает 6 мил.

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