How do an mcpcb supplier & manufacturer control pcb thermal issues?2020-04-06
Boost your metal core pcb performance with leading china mcpcb manufacturer tips
Introduction- mcpcb supplier
mcpcb supplier has a distinctive role in the increasing miniaturization and performance of electronic components. Not only the requirement for electromagnetic compatibility (EMC) but also a concept for heat management has to be developed. Similarly, reliability studies showed that 50% of the failures of electronic systems are due to the increased temperature requirements. It simply states that
This means that an mcpcb manufacturer should avoid critical temperatures. Moreover, he should also operate components within their prescribed temperature.
What should mcpcb supplier do for effective thermal management?
For effective thermal management is of particular importance to the printed circuit board. An mpcb supplier and manufacturer should take appropriate measures as early as the design and development phase for heat dissipation. Because later changes are usually more complex and costly.
According to JMS data, the major metal-based printed circuit board suppliers’ global market share rankings in 2005 were:
- NHK, and
Top 3 mcpcb supplier market share in the world
The top three mcpcb suppliers have a combined market share of 70.3%. It can be seen that companies such as Bergquist, Sanyo, and Denka dominated this high-heat-dissipation substrate market in 2005. However, to this day, many professional heat-dissipation materials suppliers including Larid and NRK have also successively invested in this market and have a place.
Speaking of Sanyo, although it is the second-largest MCPCB supplier in the world, it is not easy to see Sanyo’s high heat dissipation substrate products in Taiwan. The reason is that Sanyo began to export in April this year; and the most common MCPCB sheet on the market Most of them are manufactured and produced by six companies including E-WinTek, Dairy, Bergquist, NRK, Denka, and Laird.
Why mcpcb sheet?
Intuitively, MCPCB sheet is only regarded as a high heat dissipation substrate. You only need to consider the level of thermal conductivity. But in fact, the level of thermal conductivity is only to judge its heat dissipation performance. As the substrate still needs to consider its electrical characteristics such as:
- Breakdown voltage and its application operating characteristics
- peel strength
- tin-float test
- degradation time of burst board, etc.
What factors affect the thermal conductivity of MCPCB?
According to mcpcb supplier, Factors that affect the thermal conductivity of MCPCB include:
- the type of epoxy resin,
- type and content of inorganic fillers, etc.
Among them, the type and content of inorganic fillers greatly affect the thermal conductivity.
The thickness of the dielectric layer is the most critical factor. The thicker the dielectric layer, the higher the breakdown voltage value. However, although increasing the thickness of the dielectric layer can obtain a higher breakdown voltage value.
Therefore, an optimization between the breakdown voltage and the thermal resistance characteristics is required to determine the required thickness of the dielectric layer.
In terms of its application and operation characteristics, characteristics such as:
- peel strength
- tin-floating test and
- degradation time of bursting plate are all related to the type and content of epoxy resin.
Especially the content of the epoxy resin is the most important key factor affecting the above characteristics. Moreover, the higher the content, the better the peel strength, tin-float test and burst plate degradation time. But the thermal conductivity will also be reduced.
In view of mcpcb supplier and manufacturer, the thermal conductivity and peel strength, tin-float test and burst plate degradation time, etc. Simultaneously, there is a need to make an optimal choice between the characteristics, and then determine the best solid content or epoxy resin content.
Advantages a mcpcb supplier and manufacturer offer
1) Effective heat dissipation reduces the operating temperature of the module and extends the service life;
2) Energy density and reliability are improved up 10%;
3) Reduce dependency on heat sinks and other hardware (including thermal interface materials);
4) Reduce the volume of the product;
5) Furthermore, reduce the cost of hardware and assembly;
6) optimization combination of the power circuit and the control circuit;
7) Replace the fragile ceramic substrate and get better mechanical durability;
8) Reduce the operating temperature of the equipment;
Metal core substrate of mcpcb
How mcpcb supplier is helping to improve pcb board efficiency?
As the density of electronic circuit boards has increased, the rise in temperature due to the heat concentration of mounted components has often become a problem.
With conventional glass epoxy substrates, the heat generated from the mounted components tends to concentrate on the spot. Similarly, often resulting in exceeding the heat-resistant temperature of the components. Therefore, mcpcb manufacturer provides a metal core (copper 400μm thick) on the center layer of the board to equalize the heat generated from components and prevent heat concentration.
As the number of high-output and high-heat components such as high-brightness LEDs increases, heat generation of the components has become an issue.
How does an mcpcb supplier accumulate heat dissipation of a pcb?
An mcpcb supplier has an accumulation -how on heat dissipation for various components as a result of our participation in LED development? One of them is the use of metal substrates.
The metal substrate uses metal for the base or core and can conduct the heat of components to the housing and heat sink.
“In the past, ceramic substrates were used, but metal substrates are increasingly being selected in consideration of cost and impact resistance.”
Heat dissipation technology is also indispensable in the field of power electronics.
Devices that require metal-based substrates, such as SIC, GAN, and AMP, are increasing.
The following are the proposed solution for heat issues in mcpcb boards.
- Various combinations such as conductive foil, an insulating layer, metal base, multi-layer
- Designed with an emphasis on safety such as insulation voltage
- Temperature profile for heat dissipation component mounting
High-level technology, equipment, and experience are required to mount heat-dissipating components on products designed for heat dissipation.
An example is -how such as taking a temperature profile and taking measures to prevent the temperature from dropping rapidly.
In addition, a professional mcpcb supplier has also experienced cases of mounting improvement such as measures against solder cracks and voids.
The features of mcpcb Metal base substrate
- The metal base substrate is formed by laminating an insulating layer on a metal plate and forming a circuit on it.
- Furthermore, the base metal can be selected from aluminum, copper,and iron.
- The thermal conductivity (w / (mk)) of the insulating layer is 1.8, 3.0, 6.5, 10 or more (with processing results).
- As per mcpcb supplierand manufacturer, the higher the value of the thermal conductivity, the quicker the heat is transferred. And the thinner the insulating layer, the lower the thermal resistance.
- Moreover, it is considered that the lower the thermal resistance, the better the heat radiation characteristics of the product.
- If the insulation layer is too thin, the breakdown voltage will decrease, so a balance is needed.
- There is also a high heat resistant type. (Tg300 ℃)
MCPCB has better heat dissipation performance
Due to the high copper density, the quality of MCPCB is significantly better than any other type of PCB. However, since the application of heat sinks and accessories usually equipped with other types of PCBs is less, the application of MCPCB does not bring higher weight.
When deciding to use MCPCB, you may encounter two tips about MCPCB:
Tip 1: You should choose the appropriate copper core thickness;
Tip 2: You can also choose an aluminum core PCB.
Generally, the classification, composition and several common properties of metal-based copper-clad laminates in the PCB industry are worth collecting.
In the printing process of the PCB industry, mcpcba supplier and manufacturer often use a copper-clad laminate made of copper foil on one or both sides. The metal-based copper foil plate is generally composed of three parts:
- a metal plate
- an insulating layer and
- a conductive material (generally copper foil).
Metal-based copper-clad foils can be divided into many types due to their different structures and insulating layers. There are three common metal base structures.
The most commonly used one is the metal substrate, in addition to the covered metal substrate and the metal core substrate.
The coated metal substrate is made by sintering a layer of glaze around the metal plate. The metal core copper-clad plate is generally made of:
- aluminum plate
- steel plate
- copper plate
- copper-clad invar steel or aluminum plate as the core material.
An mcbpcb supplier coats the surface of the plate with organic polymer resin such as epoxy resin and conductor foil.
How do an mcpcb supplier develop aluminum plates?
The metal plates of metal-based copper-clad plates are usually made of iron or aluminum plates with a thickness of 0.3-2.0 mm. Some of which are made of copper plates and silicon steel sheets specially used for magnetism.
According to the mcpcb supplier research, the insulating layer also plays a role in electrical insulation and bonding of the metal plate and the copper foil. Above all, the insulating layer is generally made of epoxy resin or epoxy resin impregnated glass fiber cloth, and a small amount of polyimide resin.
In order to improve the thermal conductivity of the insulating layer, inorganic fillers are added to the resin. The thickness of the insulating layer is generally 30-100 microns.
The manufacturing method of the metal-based copper-clad laminate is the same as that of the rigid organic resin copper-clad laminate. Add a Class B thermosetting resin layer between the metal plate and the copper foil. Together, the copper foil is hot press.
Because the metal substrate has good heat dissipation performance, it can prevent the temperature rise of the components and the substrate on the printed circuit board. Moreover, among various metal substrates, the copper substrate has the best heat dissipation effect.
Its thermal conductivity is higher than aluminum. However, if copper plates and aluminum plates with the same volume ratio are used, the copper price is high and the copper density is large, which is not suitable for the development of lightweight substrate materials, so it is not widely used.
When manufacturing high heat dissipation metal substrates, copper plates can only be used in small amounts. The heat dissipation of the aluminum plate is higher than that of the iron plate.
Heat dissipation of metal-based copper clad laminate mcpcb
In the design of a printed circuit board, an mcpcb supplier should focus on insulation and reliability f the metal core pcb.
This is the relationship between the copper foil conductor circuit cover on different substrates and the fuse current. The heat dissipation of the metal substrate is large, and the fuze current has also been significantly improved.
The heat dissipation of the metal substrate depends on the thickness of the insulating layer, the thermal conductivity, and the type of metal in the metal substrate.
Mechanical behavior of an mcpcb board
The metal substrate has high mechanical strength and toughness. This is superior to ceramic-based copper-clad laminates and rigid resin copper-clad laminates. Therefore, an mcpcb supplier manufactures a large-area printed circuit board on a metal substrate. Similarly, and heavy components can be mounted on the substrate.
The metal substrate also has high dimensional stability and smoothness and can be assembled and processed on the substrate that requires hammering and riveting.
“On a printed circuit board using a metal substrate as a substrate, non-wiring components can also be bent and twisted. Certain components in electronic products need to prevent electromagnetic wave radiation. The metal substrate can play a role in shielding electromagnetic waves.”