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Proveedor de servicios de fabricación de placas de circuito impreso-miraclepwb



Proveedor de servicios de fabricación de placas de circuito impreso-miraclepwb

La fábrica Printed Circuit Board Co., Ltd. "miraclepwb" ofrece servicios para producir placas de circuito impreso, en su propio equipo de producción moderno, equipado con alta tecnología y equipos de producción que permiten la fabricación de series industriales a gran escala de placas de circuito impreso .

Printed circuit board manufacturing

Trabajas directamente con fabricantes que garantizan la calidad y tiempo de entrega de placas de circuito impreso, con personal calificado y capacidad técnica moderna.

Here you can order and manufacture printed circuit boards of any kind of complexity and almost any type: single prototypes and series of single, double-sided and multilayer printed circuit boards with classic materials such as FR 4 board s The complexity of materials on aluminum substrates, high-frequency ceramic materials, and non-standard boards has also increased.

Today, we offer the following options for the production of printed circuit boards:

The production printed circuit prototype board-the production prototype, 1-2 pieces of pilot (test, trial production), printed pattern template for debugging your product, serial quality order trumpet.

Producción en serie de placas de circuito impreso: una fabricación en serie, un tipo de placas de circuito impreso de diferentes lotes (placa tipo 1, preformas 1), que se caracteriza por una amplia gama de placas de circuito impreso de una, dos y varias capas, repetidas para mucho tiempo, su lanzamiento, calidad estable, tiempo de producción corto y precio razonable. El pedido en serie de la fotomáscara se almacena para guardarlo en el futuro, y existen opciones de fabricación.

  • Fabricación de placas de circuito impreso de una y dos caras
  • Fabricación de placas de circuito impreso multicapa
  • Fabricación de placas de circuito impreso personalizadas
  • Fabricación de placas de circuito impreso flexibles
  • Fabricación de prototipos de PCB
  • Capa superior de placa de circuito impreso
  • Posibilidades técnicas para la fabricación de placas de circuito impreso
  • Limitaciones técnicas

Fabricación de placas de circuito impreso de una y dos caras

When manufacturing one-sided and two-sided printed circuit boards as a whole, the choice of the design of the printed circuit board is an important factor in determining mechanical performance.

Single-sided and double-sided printed circuit boards now account for a significant share of the output boards, which is a compromise due to their relatively low cost and relatively high capacity.

The manufacturing process of double-sided circuit boards, as well as single-sided ones, are circuit boards used for multilayer printing as part of a more general manufacturing method. However, for single- and double-sided circuit boards, many operations are not accustomed to, technically they are manufactured, which beneficially affects production time and price easier. However, the high design rule “conductor/gap” allows the use of such boards in the manufacture of various modern products. They are very suitable for mounting holes and surface mounting.

The sequence and basic characteristics of serial production of single and double-sided printed circuit boards:

Materials used:

  1. FR-4, FR-5, FR4 high Tg, SF, STF, MI, FAF;
  2. Foil thickness, micron: 5.18, 35, 50, 70, etc., please call
  3. Board thickness, mm: 0.2 to 3.0

Double-sided printed circuit boards and

Fabricación de placas de circuito impreso multicapa

The development of the next-generation component base for the manufacture of multilayer printed circuit boards (integration, then functional microelectronics), increasingly stringent requirements for electronic devices, requiring the development of printed circuit technology, and leading to multilayer printed circuit boards (MPP) The production. Without continuous improvement of all its components and equipment, including printed circuit boards, it is impossible to achieve miniaturization of electronic equipment.

The use of chips in BGA packages increases the complexity of multilayer PCBs. As the number of layers used increases, it is necessary to use hidden and blind holes.

Our multilayer printed circuit board production is known for its various structures, high-precision technology, control equipment and years of production experience made by MPP.

We are constantly improving technology, using high-quality materials and solutions to produce modern products with high requirements for the parameters of multilayer printed circuit boards.

You directly work with manufacturers who guarantee the quality and delivery time of printed circuit boards, with qualified personnel and modern technical capabilities

Basic capabilities of multilayer PCB manufacturing-materials used:

  1. FR-4, FR-5, FR4 high Tg, SF, STF;
  2. The thickness of the outer foil, microns: 12, 18, 35, 50, 70, etc., please call
  3. Inner foil thickness, microns: 35
  4. Board thickness, mm: from 0.65 to 3.2

Fabricación de placas de circuito impreso personalizadas

Miraclepwb is a growing company that specializes in providing various services related to the production of printed circuit boards. We provide customers with multiple choices of printed circuit boards from the simplest to complex and non-standard printed circuit boards according to the needs and specific conditions of the order.

All products are made in high-precision imported equipment, which allows not only to realize the bravest decision of manufacturing and ordering terms of reference, but also to realize the printed circuit board with the highest quality.

We are constantly evolving: we monitor the smallest fluctuations in demand, we use technological innovations in production, and these innovations are now appearing in the international and domestic markets for the production of printed circuit boards.

Look at the knowledge and technology recently acquired by the global electronics industry. Sometimes, what is surprising is the speed at which technology emerges, develops, flourishes, and no one needs it anymore. The manufacturing company’s inability to develop a technology that turned out to be a dead end. At the same time, we conduct a balanced evaluation of the advantages of specific technologies (technical processes, respectively) when they are established and early development, and actively consider measures to subsequently introduce the new technology.

When making such planning and the resulting decision-making, it is necessary to consider and proceed in parallel with measures to develop our existing production infrastructure and standard technical processes related to so-called “non-standard” boards:


hdi_plate.jpg The complexity of the printed circuit board has increased-the density of the compound or HDI (High Density Interconnect) of the printed circuit board is very high. Usually, the drawing parameters of these boards are not so typical, and also smaller than the parameters specified in our production technical requirements and production capacity. Therefore, special attention is required for technicians or more quality control steps.

La pequeña placa de circuito impreso tiene extremos de metal, ideales para cumplir con los requisitos de compatibilidad electromagnética, integridad de la señal y refrigeración.
¡importante! Debe entenderse que los siguientes procesos de fabricación y / o ensamblaje requieren una banda de 1-2 mm de ancho en la placa de circuito impreso y su circuito para mantener la placa pequeña en la preforma, y ​​estas protuberancias no se pueden metalizar. Si el fragmento de pedido no tiene una posición de puente válida, el fabricante configurará el puente de acuerdo con la viabilidad técnica.
-Para la metalización final son necesarios polígonos a lo largo de los bordes para que las placas estén siempre en ambos lados. No se permiten polígonos en una capa y no se permiten polígonos en otra capa.
-La distancia mínima entre diferentes cadenas poligonales en la placa final es -6mm.
La trompeta de la placa de circuito impreso tiene un poluotverstiyami de metal ("logotipo") - que se utiliza como una placa de módulo pequeño poluotverstiya en otra salida de edición adicional en el SMT técnico.
-Diámetro mínimo -0,8 mm
-Sólo secuencia de tiempo de producción.

Printed circuit boards are most often used with metal bases, where they are designed to generate a considerable heat capacity (using components such as high-brightness LEDs, laser emitters, etc.). The basic design of this board includes a conductor layer, a metal base and a dielectric layer in between. When exposed to high voltage, the main characteristics of this board are excellent heat dissipation and improved dielectric strength.
limitation factor:
-Contour-The distance between the element and the edge topology board should be no less than 500 microns;
-Minimum drill diameter -1.0 mm;;
-When machining contours by milling, only 2.5 mm tools are used;
-Top coat-HAL only; Due to the particularity of the electrochemical process, we do not use immersion gold (ImAu) and tin (ImSn).

Radio frequency and microwave printed circuit boards are based on polyacetal with at least 3 dielectric permeability and have the lowest dielectric loss tangent, with superior thermo-mechanical stability. Currently, it meets the requirements of printed boards made of materials Flan, Diflar, Rogers, Arlon, Taconic, etc.

Frequency and microwave printed circuit board s in ceramic substrate-thermally stable microwave board s based on hydrocarbon ceramics, combining the best properties of ceramic materials and ftoroplastosoderzhaschih. These boards have sufficient rigidity and exhibit high stability of electrical and mechanical parameters over a wide temperature range. These board trumpets are used in the devices of satellite communication systems, and in particular, in the production of microstrip antennas.

Planar transformers based on multilayer printed circuit boards are replacing traditional power transformer technology. The principle of using new technology to construct electromagnetic devices is to use printed circuit boards instead of frame components and wire windings. The role of the winding in the new technology is played by the printed circuit on the board. These boards are stacked in several layers, separated by insulating materials, and encapsulated in a ferrite core.

Fabricación de placas de circuito impreso flexibles

Fabricación de placas de circuito impreso flexibles
Flexible printed circuit board s (GLP)-a printed circuit board using a flexible substrate (coated or uncoated). GPP is a multi-layer structure, including substrate (substrate), adhesive, conductive layer material and protective layer. In some cases, materials without an adhesive layer can be used.

Flexible printing (FPC)
The main field of HCP application is to use them as connectors between various parts of electronic equipment made on the basis of “conventional” (rigid PCB) to replace cable connections. In addition, inductors, antennas, etc. can be manufactured based on flexible printed circuit boards. The flexible circuit board s allows you to create unique designs, address problems mezhskhemnyh connection and installation, while providing flexibility. Flexible printed circuit board technology provides many feasible solutions, among which solutions related to creating spatial interconnect structures are particularly promising.

Flexible printed circuit board
Flexible printed circuit boards are used in various industries. In the automotive industry (panels, control systems…), household appliances (35mm cameras, cameras, calculators…), medicine (hearing aids, pacemakers…), weapons and space (satellites, panels, Radar systems, night vision equipment…), computers (print heads, disk management, cables…), industrial controls (commutators, heaters…), instruments (X-ray equipment, particle counters…) )Wait.

Compared with traditional printed circuit boards, some advantages of using flexible printed circuit boards:

  1. Dynamic flexibility,
  2. Reduce the size of the structure,
  3. Reduce weight (50-70% reduction when replacing wires, 90% reduction when replacing rigid boards),
  4. Improve assembly efficiency,
  5. Reduce assembly costs (reduce the number of operations),
  6. Increase the output of suitable products during the assembly process,
  7. Improve reliability (reduce the number of connection levels),
  8. Improve electrical performance (unify materials, characteristic impedance, reduce inductance),
  9. Improve heat dissipation (flat conductor, heat dissipation on both sides…)
  10. The possibility of three-dimensional packaging design,
  11. Compatibility with component surface mounting (compatibility in terms of expansion coefficient…),
  12. Simplified control (visual and electrical…).
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