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الصفحة الرئيسية/ مدونة/ Printed circuit board manufacturing Service provider-miraclepwb

Printed circuit board manufacturing Service provider-miraclepwb



Printed circuit board manufacturing Service provider-miraclepwb

The factory Printed Circuit Board Co., Ltd. “miraclepwb” provides services to produce printed circuit boards, in its own modern production equipment, equipped with high-tech and production equipment that allows the manufacture of large-scale industrial series of printed circuit boards.

Printed circuit board manufacturing

You directly work with manufacturers who guarantee the quality and delivery time of printed circuit boards, with qualified personnel and modern technical capabilities.

Here you can order and manufacture printed circuit boards of any kind of complexity and almost any type: single prototypes and series of single, double-sided and multilayer printed circuit boards with classic materials such as FR 4 board s The complexity of materials on aluminum substrates, high-frequency ceramic materials, and non-standard boards has also increased.

Today, we offer the following options for the production of printed circuit boards:

The production printed circuit prototype board-the production prototype, 1-2 pieces of pilot (test, trial production), printed pattern template for debugging your product, serial quality order trumpet.

Serial production of printed circuit boards-a serial manufacturing, a type of printed circuit boards of different batches (type 1 board-1 preforms), which is characterized by a wide range of single- , Double- and multilayer printed circuit boards, repeated for a long time, its release, stable quality, short production time and reasonable price. The serial order of the photomask is stored in order to save it in the future, and there are manufacturing options

  • Manufacturing one-sided and two-sided printed circuit boards
  • Manufacturing multilayer printed circuit boards
  • Manufacturing of custom printed circuit boards
  • Manufacturing of flexible printed circuit boards
  • تصنيع النماذج الأولية لثنائي الفينيل متعدد الكلور
  • Top coat of printed circuit board
  • Technical possibilities for manufacturing printed circuit boards
  • Technical limitations

Manufacturing one-sided and two-sided printed circuit boards

When manufacturing one-sided and two-sided printed circuit boards as a whole, the choice of the design of the printed circuit board is an important factor in determining mechanical performance.

Single-sided and double-sided printed circuit boards now account for a significant share of the output boards, which is a compromise due to their relatively low cost and relatively high capacity.

The manufacturing process of double-sided circuit boards, as well as single-sided ones, are circuit boards used for multilayer printing as part of a more general manufacturing method. However, for single- and double-sided circuit boards, many operations are not accustomed to, technically they are manufactured, which beneficially affects production time and price easier. However, the high design rule “conductor/gap” allows the use of such boards in the manufacture of various modern products. They are very suitable for mounting holes and surface mounting.

The sequence and basic characteristics of serial production of single and double-sided printed circuit boards:

Materials used:

  1. FR-4, FR-5, FR4 high Tg, SF, STF, MI, FAF;
  2. Foil thickness, micron: 5.18, 35, 50, 70, etc., please call
  3. Board thickness, mm: 0.2 to 3.0

Double-sided printed circuit boards and

Manufacturing multilayer printed circuit boards

The development of the next-generation component base for the manufacture of multilayer printed circuit boards (integration, then functional microelectronics), increasingly stringent requirements for electronic devices, requiring the development of printed circuit technology, and leading to multilayer printed circuit boards (MPP) The production. Without continuous improvement of all its components and equipment, including printed circuit boards, it is impossible to achieve miniaturization of electronic equipment.

The use of chips in BGA packages increases the complexity of multilayer PCBs. As the number of layers used increases, it is necessary to use hidden and blind holes.

Our multilayer printed circuit board production is known for its various structures, high-precision technology, control equipment and years of production experience made by MPP.

We are constantly improving technology, using high-quality materials and solutions to produce modern products with high requirements for the parameters of multilayer printed circuit boards.

You directly work with manufacturers who guarantee the quality and delivery time of printed circuit boards, with qualified personnel and modern technical capabilities

Basic capabilities of multilayer PCB manufacturing-materials used:

  1. FR-4, FR-5, FR4 high Tg, SF, STF;
  2. The thickness of the outer foil, microns: 12, 18, 35, 50, 70, etc., please call
  3. Inner foil thickness, microns: 35
  4. Board thickness, mm: from 0.65 to 3.2

Manufacturing of custom printed circuit boards

Miraclepwb is a growing company that specializes in providing various services related to the production of printed circuit boards. We provide customers with multiple choices of printed circuit boards from the simplest to complex and non-standard printed circuit boards according to the needs and specific conditions of the order.

All products are made in high-precision imported equipment, which allows not only to realize the bravest decision of manufacturing and ordering terms of reference, but also to realize the printed circuit board with the highest quality.

We are constantly evolving: we monitor the smallest fluctuations in demand, we use technological innovations in production, and these innovations are now appearing in the international and domestic markets for the production of printed circuit boards.

Look at the knowledge and technology recently acquired by the global electronics industry. Sometimes, what is surprising is the speed at which technology emerges, develops, flourishes, and no one needs it anymore. The manufacturing company’s inability to develop a technology that turned out to be a dead end. At the same time, we conduct a balanced evaluation of the advantages of specific technologies (technical processes, respectively) when they are established and early development, and actively consider measures to subsequently introduce the new technology.

When making such planning and the resulting decision-making, it is necessary to consider and proceed in parallel with measures to develop our existing production infrastructure and standard technical processes related to so-called “non-standard” boards:


hdi_plate.jpg The complexity of the printed circuit board has increased-the density of the compound or HDI (High Density Interconnect) of the printed circuit board is very high. Usually, the drawing parameters of these boards are not so typical, and also smaller than the parameters specified in our production technical requirements and production capacity. Therefore, special attention is required for technicians or more quality control steps.

The small printed circuit board has metal ends-ideal to meet electromagnetic compatibility, signal integrity and cooling requirements.
important! It should be understood that the following manufacturing and/or assembling processes require a 1-2 mm wide web on the printed circuit board and its circuit to keep the board small in the preform, and these protrusions cannot be metalized. If the order fragment does not have a valid jumper position, the manufacturer will set the jumper itself according to technical feasibility.
-For the final metallization, polygons along the edges are necessary for the plates to be always on both sides. Polygons are not allowed on one layer, and polygons are not allowed on another layer.
-The minimum distance between different polygonal chains on the end plate s -6mm.
The printed circuit board trumpet has a metal poluotverstiyami (“logo”)-which is used as a poluotverstiya tiny module board in another further editing output in the technical SMT.
-Minimum diameter -0.8 mm
-Production time-sequence only.

Printed circuit boards are most often used with metal bases, where they are designed to generate a considerable heat capacity (using components such as high-brightness LEDs, laser emitters, etc.). The basic design of this board includes a conductor layer, a metal base and a dielectric layer in between. When exposed to high voltage, the main characteristics of this board are excellent heat dissipation and improved dielectric strength.
limitation factor:
-Contour-The distance between the element and the edge topology board should be no less than 500 microns;
-Minimum drill diameter -1.0 mm;;
-When machining contours by milling, only 2.5 mm tools are used;
-Top coat-HAL only; Due to the particularity of the electrochemical process, we do not use immersion gold (ImAu) and tin (ImSn).

Radio frequency and microwave printed circuit boards are based on polyacetal with at least 3 dielectric permeability and have the lowest dielectric loss tangent, with superior thermo-mechanical stability. Currently, it meets the requirements of printed boards made of materials Flan, Diflar, Rogers, Arlon, Taconic, etc.

Frequency and microwave printed circuit board s in ceramic substrate-thermally stable microwave board s based on hydrocarbon ceramics, combining the best properties of ceramic materials and ftoroplastosoderzhaschih. These boards have sufficient rigidity and exhibit high stability of electrical and mechanical parameters over a wide temperature range. These board trumpets are used in the devices of satellite communication systems, and in particular, in the production of microstrip antennas.

Planar transformers based on multilayer printed circuit boards are replacing traditional power transformer technology. The principle of using new technology to construct electromagnetic devices is to use printed circuit boards instead of frame components and wire windings. The role of the winding in the new technology is played by the printed circuit on the board. These boards are stacked in several layers, separated by insulating materials, and encapsulated in a ferrite core.

Manufacturing of flexible printed circuit boards

Manufacturing of flexible printed circuit boards
Flexible printed circuit board s (GLP)-a printed circuit board using a flexible substrate (coated or uncoated). GPP is a multi-layer structure, including substrate (substrate), adhesive, conductive layer material and protective layer. In some cases, materials without an adhesive layer can be used.

Flexible printing (FPC)
The main field of HCP application is to use them as connectors between various parts of electronic equipment made on the basis of “conventional” (rigid PCB) to replace cable connections. In addition, inductors, antennas, etc. can be manufactured based on flexible printed circuit boards. The flexible circuit board s allows you to create unique designs, address problems mezhskhemnyh connection and installation, while providing flexibility. Flexible printed circuit board technology provides many feasible solutions, among which solutions related to creating spatial interconnect structures are particularly promising.

Flexible printed circuit board
Flexible printed circuit boards are used in various industries. In the automotive industry (panels, control systems…), household appliances (35mm cameras, cameras, calculators…), medicine (hearing aids, pacemakers…), weapons and space (satellites, panels, Radar systems, night vision equipment…), computers (print heads, disk management, cables…), industrial controls (commutators, heaters…), instruments (X-ray equipment, particle counters…) )Wait.

Compared with traditional printed circuit boards, some advantages of using flexible printed circuit boards:

  1. Dynamic flexibility,
  2. Reduce the size of the structure,
  3. Reduce weight (50-70% reduction when replacing wires, 90% reduction when replacing rigid boards),
  4. Improve assembly efficiency,
  5. Reduce assembly costs (reduce the number of operations),
  6. Increase the output of suitable products during the assembly process,
  7. Improve reliability (reduce the number of connection levels),
  8. Improve electrical performance (unify materials, characteristic impedance, reduce inductance),
  9. Improve heat dissipation (flat conductor, heat dissipation on both sides…)
  10. The possibility of three-dimensional packaging design,
  11. Compatibility with component surface mounting (compatibility in terms of expansion coefficient…),
  12. Simplified control (visual and electrical…).
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