Was ist 4 Schichten Hdi Rigid-Flex-Platine: (HDI-Platine Spezifikationen)2020-10-26
Was ist 4 Schichten Hdi Rigid-Flex-Platine: (HDI-Platine Spezifikationen)
What is a rigid flexible board (flex rigid board)?
A 4 Layers Hdi Rigid-flex Pcb is a printed circuit board that integrates a rigid board and a flexible board.
The advantage of this printed circuit board is that it has the same strength as a rigid board.
When combining rigid boards with flexible circuitry, the design options are endless, but we offer the most commonly used rigid flex combinations.
Flex-rigid PCB technology continues to evolve. And board manufacturers are pushing the boundaries of technology. This special feature considers this flex rigid from various perspectives such as outline, advantages and problems, and future potential.
Why 4 Layers Hdi Rigid-flex Pcb?
Manufacturing 4 Layers Hdi Rigid-flex Pcb has some similarities to multi-layer, 2D substrates. But there are many key points to carefully manage during the design process. Replacing the wires and connectors for connection with a double-sided flexible core board frees you from wiring confusion.
Pcb manufacturer can replace systems with multiple rigid PCBs connected with flex rigid to improve performance and reliability. However, to take advantage of flex technology, designers must know the flexrigid manufacturing process. And understand how to avoid design errors that can lead to manufacturing delays and increased costs.
Flex Rigid Applications
Fewer applications are not suitable for 4 Layers Hdi Rigid-flex Pcb in PCB design. However, it has not been adopted as quickly as when surface mount components replaced lead components in the 1990s.
Flex rigid is not applicable to all applications. For example, it is not suitable for replacing rigid boards such as those used for backplanes. Flex rigid boards are suitable for small handheld consumer appliances such as:
- digital cameras
- camcorders and
- MP3 players.
The munitions and aerospace industries are by far the largest users of flex-rigid technology. The biomedical industry has also adopted flex rigid for implantable devices such as:
- hearing aids
- pacemakers and
- other electronics
For these devices, the increased reliability provided by 4 Layers Hdi Rigid-flex Pcb has greatly helped. The PCB footprint can further reduces by combining thin flexible layers and replacing packaged components such as:
- inductors and
The low dielectric constants of flex and rigid laminates are also beneficial for high speed signals. Moreover, it requires impedance control.
What is the role of laminate in 4 Layers Hdi Rigid-flex Pcb?
The PCB does not have to be “flex” to take advantage of the flex laminate. Flex laminates are also available for the production of extremely thin, multi-layer rigid PCBs. A flexible insulating layer with a thickness of 0.001 “to 0.002” is convenient for manufacturing thin rigid substrates.
Manufactured using flexible laminated materials, the board itself is rigid. These multilayer boards are thinner and lighter than rigid PCBs. Similarly, they can accommodate more functions in smaller spaces. Furthermore, they have excellent impact resistance.
Flexible and Rigid-flex Pcb Types
IPC classifies flexible circuits into five board types. Type 4 is a combination of rigid and flexible materials. Hence, it corresponds to partially rigid flex and flex rigid. Type 5 is the same as Type 4, but does not include plating and through holes. IPC also classifies flexible circuits according to their application.
Flex Rigid Board Manufacturer Selection
By selecting a 4 Layers Hdi Rigid-flex Pcb manufacturer and forming a cooperative relationship at an early stage of design, it is possible to achieve the optimum yield and minimize the cost. If the design is relatively general flex rigid, you can choose from many board manufacturers.
If you have a large number of layers, you have limited options. When choosing a flex-rigid board manufacturer, it’s a good idea to look for a manufacturer that specializes in this technology. Get a sample of a standard board and get a clear understanding of your average technical level.
Compare the manufacturer’s maximum capabilities with the project requirements. We do not recommend pushing the limits of the manufacturer. The best way is to find where the manufacturer’s capabilities exceed the design requirements. But it is not too far apart to trade because they are too expensive.
Also, make sure that there are many experienced development support personnel to help you review your design. Ideally, you should have a design review team of:
- mechanical and electrical engineers
- PCB designers and
- Board makers at the beginning of your project.
Engaging these people early in the project can help reduce 4 Layers Hdi Rigid-flex Pcb costs. And it also avoids increased costs due to errors.
4 Layers Hdi Rigid-flex Pcb manufacturing trick
Rigid flexible boards are used when you want to electrically connect two rigid boards but cannot arrange them on a flat surface.
There is also a method of creating two rigid boards and one flexible board. And connecting the rigid boards with a flexible board. But two rigid boards, one flexible board, and two connectors for flexible connection are important. This will be cheaper than a rigid flexible board. But it will increase the height and weight of the flexible connection connector.
Small precision machines such as mobile phones and digital cameras are going lightweight. Rigid flexible boards, which reduce the height and weight of connectors, are particularly useful in such fields.
Features of rigid flexible board
- It has the strength of a rigid board and can form circuits.
- Light, thin, compact, high density
- Three-dimensional wiring is possible
Frequently Asked Questions:
Q : What files do I need to make a custom PCB?
A: You need a Gerber or .pcb or .pcbdoc or .brd file .
Q: What files do I need to order a custom PCB assembly?
A: You need a Gerber and a BOM file. If you have a pick-and-place file, please send it to us as well.
We can be confident that the cost reduction of 4 Layers Hdi Rigid-flex Pcb will dramatically increase its use. These products are smaller, lighter, and more reliable than they are today. It also reduces field failures due to shock and vibration. Similarly, it reduces signal noise and radiation problems by reducing the number of wires and connectors.
Dies eröffnet die nächste Verpackungsgrenze, an der Smartphones möglicherweise Laptops ersetzen und nicht mehr beide tragen müssen. Es gibt eine Möglichkeit. Korrekt?