Benutzerdefinierte 16-lagige Leiterplatten-Rückwandplatine
- Lagen: 2-58L
- Basismaterial: FR4
- Brettdicke: 0.2mm~10.0mm
- Kupferdicke: 17um~420um
- Min.Hole Size: 0.15mm
- Oberflächenveredelung: LF-HAL, ENIG
- Zertifikat: UL, ISO, ROHS
- Paket: Vaccum Packing
Innerhalb von 3 ~ 7 Tagen.
The term “PCB Backplane Circuit Board” generally refers to a larger format printed circuit board. They are the backbone that connects multiple PCBs together to ultimately form a computer bus. Typically, they do not contain active components; rather, they serve as a connection center between active duty PCBs. Backplane PCBs often incorporate a wide variety of features including blind / buried vias, high-speed / high-signal integrity materials, back drilling, and controlled impedance.
PCB Backplane Board Application
Generally used as a backbone within a system such as control panels for industrial, computing, military use. They provide greater reliability in connecting multiple PCBs due to their static nature, as opposed to cables that need to be flexed every time a card is removed, thereby reducing the life of that component/connection.
PCB Backplane Circuit Board Testing
Visual Inspection: In this test, components on the backplane are checked individually for correct placement. It also includes checking solder joints and component orientation.
Electrical Tests: This test checks the connections by sending an electrical current through the pins and traces on the board. It has two major areas to test:
- Continuity or open circuit which means there is a connection between the pins.
- Isolation or short which means there is a space between the pins to make sure that there is no connection.
The electrical test provides confirmation in two terms, i.e, ‘Continuity’ if a connection exists between the test points and ‘Short’ if doesn’t. This test is important because unwanted connections can cause interference on the board and cause malfunctions.
Functional Test: To check how the circuitry will work after integrating with the final device or application intended.
Signal Integrity Analysis and Simulation: Due to the higher speed signal formed in the base plate. To analyze such signals, network analyzers can play a role in both time and frequency domain measurements.
Miracle’s Field Advantages
Strong fabrication strength, can meet the bulk needs of different clients
> The factory invested heavily in importing foreign advanced PCB production equipment, such as Burkle laminator, Mitsubishi laser drill, Hitachi mechanical drill, Japan screen automatic exposure machine, LDI, AOI, etc, highly automated production. With a monthly output of up to 250,000 square meters.
> Our suppliers have formed a complete production process, which is becoming more specialized, modern and large-scale, has signed long-term strategic cooperation agreements with well-known enterprises at home and abroad.
> Our superb quality and leading market position are guaranteed under the ISO9001, ISO14001, ISO/TS16949, OHSAS18001, ISO/IEC27001, UL, SGS, ROHS system with our strong technical development drive. We also insist on adopting 5S methods, Lean and Six Sigma quality systems.
Miracle’s Technical Advantages
> We provide real-time and in-depth technical support. Tailor-made application solutions, like high speed, high capacity, and high frequency, press-fit, heat-sink solutions.
> Free DRC and DFM
> Rapid feedback on the layout, build-up, panels, impedance, material selection, design rules, manufacturability, costs of different solutions, use of micro vias, gold plating, special laminates, etc. We always put the best interests first when providing innovative solutions for manufacturing customers’ products
> Rocket provides industry-leading support to our customers so that we can help them grow.
Wenn wir Ihnen bei Ihrem Projekt helfen können, rufen Sie uns bitte unter + 86-755-85246345oder senden .
|Basismaterial||FR4, Aluminium, High Tg, Halogen-free, Rogers|
|Min. Lochgröße||0,15 mm|
|Plug Hole Size||0.2mm~0.6mm|
|Hole Dim. Tolerance(PTH)||±0.05mm|
|Oberflächenveredelung||LF-HAL, ENIG, ImAg, ImSn, OSP, Gold plating, ENIG+OSP, HAL+G/F|
|Testdienst||AOI/Solder Paste Testing/Function|
1. Ist es in Ordnung, wenn ich kostenlose Proben möchte?
Ja, wir können Ihnen kostenlose Muster liefern, wenn Sie einen Massenproduktionsauftrag haben.
2. What is the minimum order quantity if I want to order PCB?
We don’t have MOQ. We accept any quantity even one piece.
3. If I want to get a quotation from Aluminum PCB, Metal Core PCB, LED PCB, what should I do?
You can kindly send us the Gerber file, specifications of your requirement, we will quote immediately for you.
4. If I have special requirements for PCB material, how to deal with it?
We can make many kinds of special material PCB, for more details, please contact our sales.
5. Could you offer a custom layer stack up?
Yes, we do, in order to guarantee your PCB work well, we can offer it to you.
6. Do you supply a plastic case for our product?
We supply customized plastic or metal housing/enclosure for your PCBA products.
7. Could you do BGA assembly and X-RAY testing?
All of BGA pitch distance smaller than 0.4mm will have to go through X-RAY testing.
8. What files should I provide if order PCB or PCBA?
To make a PCB, please provide Gerber file, If you need PCBs to be assembled, you should also provide us a BOM list and Pick & place file.
9. How many days for making PCB? How long does it take for a PCBA order?
Usually 2-4 working days for PCB samples, 10-15 working days for bulk order. PCBA depends on the project, from PCB making to components purchasing till assembly work, it usually costs 2-4 weeks.
10. What payment terms are available? Can I pay via PayPal, T/T, Western Union?
We accept Paypal, T/T, Western Union. If you have any other questions about payment, please contact us to senden .