Home / Blog / High volume pcb manufacturing Cost in 2021

High volume pcb manufacturing Cost in 2021


What is High volume pcb manufacturing?

A High volume pcb manufacturing is a plate of dielectrics that is stenciled as a circuit. On it there are silvery tracks come of materials that are characterized by increased current conductivity. Thanks to the creation of printed circuit boards, it was possible to achieve a significant reduction in the volume of electronic devices.

The cost of the devices already includes the price of printed circuit boards, since usually this process entrust to a specialized company that assembles components in various ways. Thanks to competent specialists and modern equipment, the company will carry out this process efficiently and in a short time.

High volume pcb manufacturing

What are the types of High volume pcb manufacturing

What is PCB Mounting? The surface on which the individual elements assemble and come in advance – this is the process of placing capacitors, resistors and other components important for the operation of electronics on the board. There are two main types of High volume pcb manufacturing mounting:

  1. Surface Mount – when components automatically attach to the surface of the board. It also has another name – SMD technology.
  2. Output installation. Holes are prepared in advance on the board, into which the elements are fastened. The components come on the back side of the board surface. Also, in another way, lead-out assembly is called TNT technology.

High volume pcb manufacturing assembly is increasingly a matter of surface mount

Today, PCB assembly is increasingly a matter of surface mount. SMD technology makes it possible to achieve automation of production, and therefore, to reduce the cost of production. Also surface mount is great for small components.

In some cases, mixed installation is carried out, when some of the elements mount on the board automatically, and the other manually. It is the assembly and installation of components that is the most important basis for the reliability of electronic devices and their durability.

The main stages of High volume pcb manufacturing

  • Installation of components on a High volume pcb manufacturing.
  • Cleaning the board from flux.
  • Also, Application of a protective agent.

The main method of connecting the board to the components is soldering, the essence of the process is to solder the parts using solder. Soldering provides a strong connection of the elements with the conductors of the electronic module.

To make the parts firmly connected to the board, they treat with flux – a special mixture of a chemical material. Also, allocate wave soldering, reflow soldering in convection-type ovens, contactless and selective soldering, there is also laser soldering.

Wave soldering method of High volume pcb manufacturing

This method allows the bonding of electronic parts or connecting elements after manual or surface mounting on a board. Also, the method bears this name, since a wave of molten solder create using mechanical activators.

Wave assembly of components to a PCB begins by spraying or passing the PCB through a foaming area, then preheating the PCB, then sweeping the High volume pcb manufacturing over one, sometimes two waves of solder and covering it for bonding.

High volume pcb manufacturing Wave soldering benefits

  • The volume and density of the elements do not matter.
  • The technology is fast and economical, which increases the efficiency of the processes.
  • The components are exposed to minimal thermal stress – the modules solder on one side.

Wave soldering is typically common for push-through mounting of components to a PCB, but this method also installs SMD components on the bottom surface of the module.


High volume pcb manufacturing reflow soldering

The reflow soldering method guarantees higher mechanical stability and enables automation of production. This is a process in which a solder paste in the form of a powder compound and a flux is common to temporarily bond the components to a work surface, then the entire assembly is subject to a predetermined temperature regime.

In the oven, the board moves along the conveyor through several temperature modes – the preheating zone, the soldering and cooling modes, each of the modes has a set temperature. The board exposes to maximum heat for a short time, followed by a cooling phase. There is also a stabilization zone where temperature equalization takes place.

High volume pcb manufacturing reflow soldering benefits

  • High quality process
  • Excellent mechanical stability of the components.
  • Exact adherence to the set temperature regimes.

Reflow soldering of components to a High volume pcb manufacturing is best for automated assembly technology.

High volume pcb manufacturing automatic pcb soldering

Serial and small-scale production of printed circuit boards is easy to carry out with automated technology.

The use of professional automatic machines makes it possible to perform complex soldering of elements, which makes it possible to achieve high quality connections, stable repeatability of contacts and optimal temperature conditions.



The standard process for assembling automatic surfaced PCBs involves:

  • A professional paste is applying to the designate places.
  • Also, the resistance of the paste is check at the contact points.
  • Installation of electrical parts is in progress.
  • Moreover, the technology for general soldering is select.
  • Control and quality control of connections.
    High volume pcb manufacturing 2021

How to apply the paste on high volume pcb?

Automatic soldering of High volume pcb manufacturing includes the most important part of the installation – the application of adhesive paste. It has a sticky gel-like texture, it contains a powdery material, activators, flux and various types of additives. In the process of soldering printed circuit boards, solder paste performs certain functions:

  • Acts as a joint solder for workpieces.
  • Also, it is a cleaner of the working surface of the board and elements from the oxide film, which can negatively affect the soldered components.
  • Holds mountable contacts on the side of the board until the soldering procedure begins.


A modern and technologically advanced method of applying solder paste is ink jet printing. Droplets of material fall out of the cartridge, so it tunes to accurately direct to a specific part of the board according to the intended pattern.

email chevron up