como se fabrica paso a paso un pcb

como se fabrica paso a paso un pcb

Hoy, jugaremos un papel único para nosotros. No hablaremos de gadgets, sino de la tecnología que hay detrás de ellos. Hace un mes estábamos en Kazán, donde conocimos a muchachos del campus de Shenzhen. Al mismo tiempo, visitamos la cercana (relativamente cercana) fabricación de PCB de miraclepwb. Este artículo intenta comprender cómo producir la misma placa de circuito impreso. Entonces, ¿cómo hacer una placa de circuito impreso para nuestro dispositivo favorito?

La fábrica sabe cómo hacer placas de circuito de principio a fin: diseñar placas de circuito de acuerdo con sus especificaciones técnicas, fabricar fibra de vidrio, producir placas de circuito impreso de una y dos caras, producir placas de circuito impreso multicapa, marcado, inspección, manual y automático Montaje y soldadura de placa de circuito.
Primero, te mostraré cómo hacer un panel doble. Su proceso técnico no es diferente de la producción de placas de circuito impreso de una cara, excepto que la segunda cara no se opera durante el proceso de fabricación de OPP.

About PCB manufacturing method
Generally, all methods of manufacturing printed circuit boards can be divided into two major categories: addition (from Latin addition-addition) and subtraction (from Latin subtraction-subtraction). An example of subtraction technology is the well-known LUT (Laser Ironing Technology) and its variants. In the process of using this technology to create printed circuit boards, we use the toner in the laser printer to protect the future trajectory on the glass fiber board, and then ooze out all the unnecessary things in the ferric chloride.
In contrast, in the add-on method, conductive traces are applied to the dielectric surface in one way or another.
Semi-addition (sometimes called combined method)-a cross between classical addition and subtraction. In the process of producing PCBs using this method, part of the conductive coating can be etched away (sometimes it is corroded almost immediately after coating), but generally, this is faster/easier/cheaper than the subtractive method. In most cases, this is due to the fact that most of the thickness of the track is formed by electroplating or chemical methods, and the etched layer is very thin and only serves as a conductive coating for electroplating.
I will show exactly how to combine.

Use positive composite method (semi-additive method) to manufacture two-layer printed circuit boards
Glass fiber manufacturing
The process begins with the manufacture of foil-clad glass fibers. Fiberglass is a material composed of glass fiber sheets (looks like dense, shiny fabrics) that are impregnated with epoxy resin and laminated into one piece.
Fiberglass canvas itself is not too simple-they are woven with thin glass threads (just like ordinary fabric on shirts). They are so thin that they can be easily bent in any direction. It looks like this:

It’s too long, I have to sew this photo from a few frames. This is a Swiss machine from Posalux. Unfortunately, I don’t know the exact model. According to its characteristics, it is close to this. It consumes a three-phase voltage of 400V, which is three times that of a three-phase power supply, and consumes 20 kW during operation. The weight of the machine is about 8 tons. It can process four batches simultaneously using different programs, which provides a total of 12 plates per cycle (naturally, all workpieces in a batch will be drilled in the same way). Drilling cycle-from 5 minutes to several hours, depending on the complexity and number of holes. The average time is about 20 minutes. Technotech has three such machines.